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The figure shows the outline diagram of a butterfly shaped packaged optical device. Due to its butterfly like appearance, this packaging form is called butterfly shaped packaging. Butterfly shaped packaging technology is widely used in high-speed, long-distance fiber optic communication systems. The butterfly shaped tube shell has the following characteristics: large space inside the packaging, easy installation of semiconductor thermoelectric refrigerators, and corresponding temperature control functions; The relevant laser chips, lenses, and other components are easy to layout inside the body; The legs are distributed on both sides, making it easy to connect the circuit; And the structure is convenient for testing and packaging. The shell is usually a rectangular shape, with a complex structure and implementation functions. It can be equipped with built-in refrigerators, heat sinks, ceramic substrates, chips, thermistors, backlight monitoring, and can support bonding leads for all the above components. The shell has a large area, good heat dissipation, and can be used for various speeds and long-distance transmission of 80km.
The figure shows the outline diagram of a butterfly shaped packaged optical device. Due to its butterfly like appearance, this packaging form is called butterfly shaped packaging. Butterfly shaped packaging technology is widely used in high-speed, long-distance fiber optic communication systems. The butterfly shaped tube shell has the following characteristics: large space inside the packaging, easy installation of semiconductor thermoelectric refrigerators, and corresponding temperature control functions; The relevant laser chips, lenses, and other components are easy to layout inside the body; The legs are distributed on both sides, making it easy to connect the circuit; And the structure is convenient for testing and packaging. The shell is usually a rectangular shape, with a complex structure and implementation functions. It can be equipped with built-in refrigerators, heat sinks, ceramic substrates, chips, thermistors, backlight monitoring, and can support bonding leads for all the above components. The shell has a large area, good heat dissipation, and can be used for various speeds and long-distance transmission of 80km.
