, from material assembly, high temperature sintering, surface treatment (electrochemical plating), part welding to product testing, completely independent production; The products involve glass encapsulation of Kovar alloy, iron nickel alloy, stainless steel, low carbon steel, tungsten and copper and other metal materials glass packaging and metal brazing. In the second half of 2022, the company was launched a new pilot line of
to conduct research and development and production of ceramic packaging shell.
At present, the products mainly cover the
TO series headers and caps, butterfly packaging, cavity packaging, photoelectric metal shell, devices, hybrid integrated circuit, high power laser shell, microwave, RF terminal, flow terminal, OCXO housing, crystal resonator base, crystal oscillator base, UM base, ceramic LED bracket, SMD series base , and
its products cover more than 500 specifications. Widely used in optical communication, sensing, Internet of things, microelectronics, medical defense, automotive, national defense, aerospace and other fields.
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