High-temperature co-fired ceramics (HTCC) offer high reliability, high integration, miniaturization, and multi-layer packaging. They support multi-cavity and multi-channel structure designs. Our product range includes ceramic substrates, ceramic bases, ceramic housings, and ceramic tubes.
These products are used in optical communications, cooled/non-cooled infrared imaging, SMD transistors, wireless power devices, infrared detectors, high-power lasers, and 3D optical sensors.
High-Temperature Co-Fired Ceramic (HTCC) offers advantages such as high mechanical strength, high wiring density, stable chemical properties, excellent thermal conductivity, and low material cost. These characteristics make HTCC widely applicable in packaging fields requiring superior thermal stability, minimal high-temperature outgassing, and stringent hermeticity. HTCC-based ceramic packaging products primarily include ceramic multilayer substrates and ceramic housings.
Product Portfolio: Our company specializes in:
25G TOSA/ROSA (Transmitter/Receiver Optical Sub-Assembly) modules
We also provide custom solutions tailored to client-supplied designs or drawings.
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