Ceramic Packages（HTCC)

High-temperature co-fired ceramics (HTCC) offer high reliability, high integration, miniaturization, and multi-layer packaging. They support multi-cavity and multi-channel structure designs. Our product range includes ceramic substrates, ceramic bases, ceramic housings, and ceramic tubes.

These products are used in optical communications, cooled/non-cooled infrared imaging, SMD transistors, wireless power devices, infrared detectors, high-power lasers, and 3D optical sensors.