Laser Diode Butterfly Package

Butterfly packages are widely used in high-speed, long-distance fiber optic communication systems.

The butterfly shell has the following features: 

• Large internal space for semiconductor thermoelectric cooler mounting to achieve temperature control;

• Convenient internal layout for laser chips, lenses, etc.; 

• Legs distributed on both sides for easy circuit connections. 

The structure is easy to test and package. The casing is usually rectangular, and supports all components like coolers, heat sinks, ceramic substrates, chips, thermistors, and backlight monitors, with good heat dissipation, suitable for high-speed and long-distance transmission up to 80km.