Butterfly packages are widely used in high-speed, long-distance fiber optic communication systems.
The butterfly shell has the following features:
Large internal space for semiconductor thermoelectric cooler mounting to achieve temperature control;
Convenient internal layout for laser chips, lenses, etc.;
Legs distributed on both sides for easy circuit connections.
The structure is easy to test and package. The casing is usually rectangular, and supports all components like coolers, heat sinks, ceramic substrates, chips, thermistors, and backlight monitors, with good heat dissipation, suitable for high-speed and long-distance transmission up to 80km.
Butterfly Package is a standardized packaging format used for optoelectronic devices, commonly applied to components such as laser diodes (LDs) and photodetectors (PDs). The name derives from its distinct shape, which resembles the wings of a butterfly.
Key advantages of butterfly-packaged optoelectronic devices include standardized dimensions, lightweight design, high reliability due to hermetic sealing, and ease of manufacturing and assembly into application-specific modules. These features make butterfly packages widely utilized in modern optical communication systems and fiber optic sensing applications.
Specifications and Configurations:
Pin Count: Butterfly packages are typically categorized by their pin configurations. Common variants include 14-pin, with smaller numbers such as 8-pin or compact single-sided 8-pin/6-pin designs.
Optical Ports: The optical interface options include: Single-fiber output: Predominantly used for laser diodes. Dual-fiber output: Commonly adopted for semiconductor optical amplifiers (SOAs).
Product Portfolio: Our company offers a comprehensive range of butterfly packages, including 14-pin, 6-pin, 8-pin, 10-pin, and single-sided 14-pin configurations, tailored to diverse industry requirements.
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