English
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1.Basic Info.
| Model NO. | TO5603 |
| Type | Reflective Panels Type Photoelectric Sensor |
| Model | To56 03 |
| Pin Type | Kovar |
| Materlal | SPCC,Glass |
| Pin Quantity | 2/3/4/5/6/7 Pin |
| Authentication | ISO,RoHS |
| Customize or Not | Customized |
| Application | Transceiver Module for Optical Commanilation |
| Gold Thinckness Test | Customer Requirements for Production |
| Standard Export Packing | Standard Ecport Packing |
| Source | China |
| Brand | XR |
| HS Code | 3711930783 |
2.Product Description
| NO. | Item | Condition | Standard |
| 1 | Insulation capability | Relative humidity less than 50%,and the temperature at 25±5ºC | More than 1×109Ω at DC500V and More than 1×1010Ω at DC50V |
| 2 | Leak test | Test with a helium mass spectrometer. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 3 | Lead loose | 3×180°bending after bent lead 90°and apply a force of 3N. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 4 | Lead tension | 25N tension 5-10sec | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 5 | Lead bending | 3×(±90°)with a weight of 2.25N | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 6 | High temperature impact | 300ºC 10min. natural cooling | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 7 | Bake test | 320ºC 5min | Not changing the color |
| 8 | Plating adherence | 2-6coiled at a Φ1mm mandrel | Nickel plating must be adherent,no peeling and no blistering. |
| 9 | Solderrability of leads | 160ºC 90min,flux 5-10s ,tinbath at 255±5ºC,5±0.5 seconds. | Leads shall be covered with solder up to 95%. |
Material of TO56 HEADER:
EYELET:SPCC
PIN:KOVAR
GLASS
Au:0.05-0.2um or special customized
TO56 series header has 2pin,3pin,4pin,5pin,6pin,7pin
TO56 header 3P4L is used in lasers.
The TO56 base is a packaging component used for lasers and photoelectric sensors, and gold plating is one of its important surface treatment processes. The gold-plating function and characteristics of the TO56 base are as follows: function: to enhance conductivity: gold-plating can provide a good conductive connection between the base and other components to ensure signal transmission.
We can provide 10-15pcs free samples for testing!If you need, please feel free to contact us!
Product advantages:
1.Customizable production with multiple specifications to choose from;
2.Can support mainstream TO packaged lasers currently on the market;
3.Other TO packaged heat dissipation bases can support customization;
4.Compatible with lasers of various powers, capable of supporting high-power lasers;
5.Equipped with TEC cooling and good body heat dissipation function, it can accurately adjust the working temperature of the laser;
6.Convenient for alignment, with a standard mirror tube thread on the front and a coaxial device for adjusting the alignment of the optical path;
Company Information&Services:
A.Every customer's admiration is our goal and future willing, we are concentrated in doing the best quality products, supplying the best goods and service.We striving to become a world-class service provider in the field of electronic hermetic packaging.
B.Main products: TO series headers and caps, butterfly packaging, cavity packaging, photoelectric metal shell, devices, hybrid integrated circuit, high power laser shell, microwave, RF terminal, flow terminal, OCXO housing, crystal resonator base, crystal oscillator base, UM base, ceramic LED bracket, SMD series base , and its products cover 13 series more than 500 specifications. Widely used in optical communication, sensing, Internet of things, microelectronics, medical defense,automotive, national defense, aerospace and other fields.
Sintering and surface treatment ability:
With sintering furnace, oxidation furnace, brazing furnace, brazing furnace, vacuum furnace, sintering furnace, meet different process design requirements, products involving alloy, iron-nickel alloy, stainless steel, low steel, tungsten, aluminum alloy and other metal materials of glass / ceramic packaging and metal brazing.
Self-built electrochemical plating production line, approved by the environmental protection bureau for pollutant discharge qualification. Independent grasp of surface treatment technology, can comprehensively control the surface treatment process, and can quickly and flexibly respond to the different coating thickness requirements of the client. Electroplating and chemical plating rolling plating and hanging plating integral plating, partial plating nickel plating, copper, gold, tin, etc., to meet various process requirements
1.Basic Info.
| Model NO. | TO5603 |
| Type | Reflective Panels Type Photoelectric Sensor |
| Model | To56 03 |
| Pin Type | Kovar |
| Materlal | SPCC,Glass |
| Pin Quantity | 2/3/4/5/6/7 Pin |
| Authentication | ISO,RoHS |
| Customize or Not | Customized |
| Application | Transceiver Module for Optical Commanilation |
| Gold Thinckness Test | Customer Requirements for Production |
| Standard Export Packing | Standard Ecport Packing |
| Source | China |
| Brand | XR |
| HS Code | 3711930783 |
2.Product Description
| NO. | Item | Condition | Standard |
| 1 | Insulation capability | Relative humidity less than 50%,and the temperature at 25±5ºC | More than 1×109Ω at DC500V and More than 1×1010Ω at DC50V |
| 2 | Leak test | Test with a helium mass spectrometer. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 3 | Lead loose | 3×180°bending after bent lead 90°and apply a force of 3N. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 4 | Lead tension | 25N tension 5-10sec | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 5 | Lead bending | 3×(±90°)with a weight of 2.25N | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 6 | High temperature impact | 300ºC 10min. natural cooling | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 7 | Bake test | 320ºC 5min | Not changing the color |
| 8 | Plating adherence | 2-6coiled at a Φ1mm mandrel | Nickel plating must be adherent,no peeling and no blistering. |
| 9 | Solderrability of leads | 160ºC 90min,flux 5-10s ,tinbath at 255±5ºC,5±0.5 seconds. | Leads shall be covered with solder up to 95%. |
Material of TO56 HEADER:
EYELET:SPCC
PIN:KOVAR
GLASS
Au:0.05-0.2um or special customized
TO56 series header has 2pin,3pin,4pin,5pin,6pin,7pin
TO56 header 3P4L is used in lasers.
The TO56 base is a packaging component used for lasers and photoelectric sensors, and gold plating is one of its important surface treatment processes. The gold-plating function and characteristics of the TO56 base are as follows: function: to enhance conductivity: gold-plating can provide a good conductive connection between the base and other components to ensure signal transmission.
We can provide 10-15pcs free samples for testing!If you need, please feel free to contact us!
Product advantages:
1.Customizable production with multiple specifications to choose from;
2.Can support mainstream TO packaged lasers currently on the market;
3.Other TO packaged heat dissipation bases can support customization;
4.Compatible with lasers of various powers, capable of supporting high-power lasers;
5.Equipped with TEC cooling and good body heat dissipation function, it can accurately adjust the working temperature of the laser;
6.Convenient for alignment, with a standard mirror tube thread on the front and a coaxial device for adjusting the alignment of the optical path;
Company Information&Services:
A.Every customer's admiration is our goal and future willing, we are concentrated in doing the best quality products, supplying the best goods and service.We striving to become a world-class service provider in the field of electronic hermetic packaging.
B.Main products: TO series headers and caps, butterfly packaging, cavity packaging, photoelectric metal shell, devices, hybrid integrated circuit, high power laser shell, microwave, RF terminal, flow terminal, OCXO housing, crystal resonator base, crystal oscillator base, UM base, ceramic LED bracket, SMD series base , and its products cover 13 series more than 500 specifications. Widely used in optical communication, sensing, Internet of things, microelectronics, medical defense,automotive, national defense, aerospace and other fields.
Sintering and surface treatment ability:
With sintering furnace, oxidation furnace, brazing furnace, brazing furnace, vacuum furnace, sintering furnace, meet different process design requirements, products involving alloy, iron-nickel alloy, stainless steel, low steel, tungsten, aluminum alloy and other metal materials of glass / ceramic packaging and metal brazing.
Self-built electrochemical plating production line, approved by the environmental protection bureau for pollutant discharge qualification. Independent grasp of surface treatment technology, can comprehensively control the surface treatment process, and can quickly and flexibly respond to the different coating thickness requirements of the client. Electroplating and chemical plating rolling plating and hanging plating integral plating, partial plating nickel plating, copper, gold, tin, etc., to meet various process requirements
