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Metal 14PIN butterfly package with side window opening

Metal 14PIN butterfly package with side window opening

14 pin butterfly packaging is commonly used in integrated circuits or optoelectronic devices. In optoelectronic devices, 14 pin butterfly packaging is commonly used for laser diodes or photodetectors. In integrated circuits, 14 pin butterfly packaging may be used for specific analog integrated circuits or optical communication devices. Butterfly packaging adds functions such as temperature control and fiber coupling on top of TO packaging, making it suitable for medium to high power lasers. Its structure is a rectangular shell with multiple pins and silicone sealing, which can effectively prevent dust and moisture from entering and ensure the stability of the laser.

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Name	Performance Standard
gas tightness	Using helium mass spectrometer leak detector, leakage rate is less than 1x10-9Pa.m /s(He)
insulation resistance	DC500V humidity less than 50%, insulation resistance greater than 10000MΩ
Dielectric withstand voltage	The duration is 60S, the rate of applied voltage is 500V/s, no breakdown discharge and damage.
Bending stress of pin	Easy-to-bend lead: rectangular cross-section ≤ 0.15 * 0.51 and circular cross-section ≤ 0.51 in diameter, bending into a circular arc at 3.05± 0.76mm from the sealing position, bending angle at least 45, bending three times, after the stress is removed, there is no breakage, loosening or relative between the lead and the device body when magnifying 10-20 times. Without mobile phenomenon.
	Semi-flexible lead: rectangular cross-section (≥ 0.15 * 0.51) and circular cross-section (≥ 0.51) with a diameter (≥0.51) are bent into a circular arc at 3.05±0.76mm from the sealing position of the lead. The bending angle is at least 30 degrees and bends three times. After stress is removed, there is no breakage, loosening or phase between the lead and the device body when the stress is magnified 10-20 times. Without the phenomenon of mobility.
Pin fatigue	When the cross-sectional area of the lead (≥ 0.15mm * 0.51mm) or the diameter of the lead (≥ 0.51mm), the lead hangs on the weight of 2.22N (+ 0.14N) and the shell rotates 90°±5° three times, each time rotates 2S-5S and amplifies 10-20 times, there is no breakage, loosening or relative movement between the lead and the device body.
	When the lead cross-section area is ≤ 0.15mm * 0.51mm or the diameter is 0.51mm, the pin is hung with 0.83N±0.09N weight and the shell is rotated at 90°±5° [3 times] and rotated at 2S-5S each time. There is no breakage, loosening or relative movement between the lead and the device body when the lead is magnified 10-20 times.
Pin pulling force	Pull 2.22N tension under the lead and keep 30S. After removing the stress, magnify 10 times. There is no breakage, loosening or relative movement between the lead and the device body
Weldability test	The tin bath is kept at 245ºC±5ºC, the soaking time is 245C°±5C°, the diameter of lead wire is not less than 1mm, and the soaking time is 7S±0.5S. At least 95% of the tin surface is covered at the extraction end; pinholes, voids, pores, unleached tin or tin removal are not more than 5% of the total area.
Gold layer quality test	The product was plated with gold and placed in a 450 ±10 ºC oven in air for 120~130s. No bubbles, peeling and peeling were observed on the surface of the product with 10 times magnifying glass, and no discoloration occurred at the bonding zone, the surface of the sealing ring or the external pin.
Nickel layer quality test	After nickel plating, the product is put into 450±10°C oven under nitrogen condition. The product is cooled to 100°C after residence time of 15 ~ 16 minutes. No bubbles, peeling and peeling were observed on the surface of the product with 10 times magnifying glass, and no discoloration occurred at the bonding zone, the surface of the sealing ring or the external pin.
Salt spray test	Salt solution concentration should be 0.5% - 3.0% deionized water or distilled water solution, measured at 35ºC±3ºC, pH 6.5 - 7.2, 24 hours; corrosion defect area exceeded 5% of the area of coating or base metal of any package part (such as cover plate, casing or cap) other than lead. It is regarded as invalid.
Gold thickness test	It can be customized according to customer requirements.
Storage conditions
Products should be stored in a dry, ventilated, non-corrosive gas warehouse with a temperature of -10°C ±40°C and a relative humidity of not more than 80%.

Material of Butterfly header：Ceramic/Glass EYELET:SPCC SHELL: oxygen-free copper
PIN:KOVAR
GLASS

Au:0.5-1.27um or special customized

Butterfly header 7pin,8pin,14pin,

The main features of the butterfly package include:

Structure: Butterfly packages are typically made of metal or ceramic and have two parallel protrusions, one for encapsulating a laser diode or light detector and the other for connecting electrodes and providing mechanical support.

Laser diode package: For the laser diode, it is placed in a port of the butterfly package, led through the electrode and connected to the external circuit through the other end of the butterfly package.

Photodetector package: For the photodetector, the sensitive component is also placed in a port of the butterfly package, which is led out through the electrode and connected to the external circuit.

Heat dissipation design: The structure of the butterfly package provides a certain heat dissipation capability, which helps the laser diode or light detector to dissipate heat during operation.

Optical window: Packages typically have transparent optical Windows to allow the input and output of laser or optical signals.

Application: Butterfly package is widely used in optical communication, laser, optical detection, optical fiber communication and other fields.

Connectors: Butterfly packages usually have standard electrical connectors for easy connection to other devices.

Company Information&Services: A.Every customer's admiration is our goal and future willing, we are concentrated in doing the best quality products, supplying the best goods and service.We striving to become a world-class service provider in the field of electronic hermetic packaging.

B.Main products: TO series headers and caps, butterfly packaging, cavity packaging, photoelectric metal shell, devices, hybrid integrated circuit, high power laser shell, microwave, RF terminal, flow terminal, OCXO housing, crystal resonator base, crystal oscillator base, UM base, ceramic LED bracket, SMD series base , and its products cover 13 series more than 500 specifications. Widely used in optical communication, sensing, Internet of things, microelectronics, medical defense,automotive, national defense, aerospace and other fields.

Sintering and surface treatment ability:

With sintering furnace, oxidation furnace, brazing furnace, brazing furnace, vacuum furnace, sintering furnace, meet different process design requirements, products involving alloy, iron-nickel alloy, stainless steel, low steel, tungsten, aluminum alloy and other metal materials of glass / ceramic packaging and metal brazing.

Self-built electrochemical plating production line, approved by the environmental protection bureau for pollutant discharge qualification. Independent grasp of surface treatment technology, can comprehensively control the surface treatment process, and can quickly and flexibly respond to the different coating thickness requirements of the client. Electroplating and chemical plating rolling plating and hanging plating integral plating, partial plating nickel plating, copper, gold, tin, etc., to meet various process requirements

Packaging&Shipping:

1.It will be shipped by DHL/FedEx/ S.S / air transport, please contact us to choose the best one.

2.Plastic box, ESD bag, Aviation packaging, standard and normal package.

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Metal 14PIN butterfly package with side window opening

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