The company has launched a new HTCC product production line, extending from metal packaging to ceramic packaging

In recent years, technological change and update applications are fast, high-end manufacturing products continue to emerge, and emerging fields such as intelligent cars, the Internet of Things, drones, and data centers have developed rapidly. As the key material of semiconductor devices, electronic ceramic shells are widely used in communication, industrial lasers, consumer electronics, automotive electronics and other fields, and can meet the development of emerging fields such as intelligent vehicles, Internet of things, drone market, virtual reality (VR). Driven by the new and continuous growth of downstream demand, the application field of HTCC shell products continues to expand. In order to meet the market development trend, the company began to extend from metal packaging to ceramic packaging.

As one of the key components of the integrated circuit, the package shell mainly plays the role of circuit support, electrical signal transmission, heat dissipation, sealing and chemical protection, and plays an important role in the reliability of the circuit and the proportion of the circuit cost. At present, the main metal glass packaging and ceramic packaging as the mainstream trend of the performance of the two materials are briefly introduced;

 封装结构示意图

Package structure

1) Metal glass package

Metal glass packaging is mainly made of metal materials, with good thermal conductivity and electromagnetic interference resistance. The main features of metal packaging are as follows:

High thermal conductivity: The thermal conductivity of the metal package is superior, and the heat generated by the internal components can be effectively transferred to the external heat dissipation system, ensuring the stability and reliability of the components in high temperature environments.

Anti-electromagnetic interference: metal materials have good shielding effect, and metal glass packaging can effectively resist external electromagnetic interference to ensure the normal operation of components.

Strong pressure resistance: metal glass packaging has a strong pressure resistance, can withstand high external pressure, suitable for high pressure environment applications.

However, metal glass packaging also has certain disadvantages:

Larger weight: The density of metal glass packaging is higher and the weight is larger, which may adversely affect the weight and volume of the product.

High cost: The cost of metal glass materials is relatively high, resulting in the overall cost of metal glass packaging is also high.

2) Ceramic metal package

Ceramic packaging is a form of packaging made of ceramic materials, with good electrical properties and thermal stability. The main features of ceramic packaging are as follows:

Good thermal stability: the ceramic material has a low coefficient of thermal expansion, and the dimensional stability of the ceramic package is good in the high temperature environment, which helps to improve the reliability of the component.

Good electrical performance: Ceramic materials have high insulation performance and low dielectric loss, which is conducive to improving the electrical performance of components.

Strong chemical stability: Ceramic materials have strong corrosion resistance and oxidation resistance, so that ceramic packaging can remain stable in harsh chemical environments.

Although ceramic packaging has many advantages, there are also certain disadvantages:

High cost: The cost of ceramic materials and production processes is relatively high, resulting in the overall cost of ceramic packaging is also high.

Large brittleness: The impact resistance of ceramic materials is low, and it is easy to break under the action of external forces.

According to the current development of market demand, the pilot line of HTCC ceramic products has been opened in the second half of 2022 for the research and development and production of ceramic packaging shells. According to the market demand, the company's new ceramic production line, increase the research and development of ceramic packaging products. Below are some pictures of the company's products.

车间示意图（Workshop）