English
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1.Basic Info.
| Type | Reflective Panels Type Photoelectric Sensor |
| Model | To46 8pin |
| Pin Type | Kovar |
| Materlal | Cpcc Glass |
| Pin Quantity | 2/3/4/5/8 Pin |
| Authentication | ISO,RoHS |
| Customize or Not | Customized |
| Application | Alarm System,Sensor System |
| Gold Thinckness Test | Customer Requirements for Production |
| Standard Export Packing | Standard Ecport Packing |
| Source | China |
| Brand | XR |
| HS Code | 3711930783 |
2.Product Description
| NO. | Item | Condition | Standard |
| 1 | Insulation capability | Relative humidity less than 50%,and the temperature at 25±5ºC | More than 1×109Ω at DC500V and More than 1×1010Ω at DC50V |
| 2 | Leak test | Test with a helium mass spectrometer. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 3 | Lead loose | 3×180°bending after bent lead 90°and apply a force of 3N. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 4 | Lead tension | 25N tension 5-10sec | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 5 | Lead bending | 3×(±90°)with a weight of 2.25N | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 6 | High temperature impact | 300ºC 10min. natural cooling | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 7 | Bake test | 320ºC 5min | Not changing the color |
| 8 | Plating adherence | 2-6coiled at a Φ1mm mandrel | Nickel plating must be adherent,no peeling and no blistering. |
| 9 | Solderrability of leads | 160ºC 90min,flux 5-10s ,tinbath at 255±5ºC,5±0.5 seconds. | Leads shall be covered with solder up to 95%. |
Company Information&Services:
A.Every customer's admiration is our goal and future willing, we are concentrated in doing the best quality products, supplying the best goods and service.We striving to become a world-class service provider in the field of electronic hermetic packaging.
B.Main products: TO series headers and caps, butterfly packaging, cavity packaging, photoelectric metal shell, devices, hybrid integrated circuit, high power laser shell, microwave, RF terminal, flow terminal, OCXO housing, crystal resonator base, crystal oscillator base, UM base, ceramic LED bracket, SMD series base , and its products cover 13 series more than 500 specifications. Widely used in optical communication, sensing, Internet of things, microelectronics, medical defense,automotive, national defense, aerospace and other fields.
Sintering and surface treatment ability:
With sintering furnace, oxidation furnace, brazing furnace, brazing furnace, vacuum furnace, sintering furnace, meet different process design requirements, products involving alloy, iron-nickel alloy, stainless steel, low steel, tungsten, aluminum alloy and other metal materials of glass / ceramic packaging and metal brazing.
Self-built electrochemical plating production line, approved by the environmental protection bureau for pollutant discharge qualification. Independent grasp of surface treatment technology, can comprehensively control the surface treatment process, and can quickly and flexibly respond to the different coating thickness requirements of the client. Electroplating and chemical plating rolling plating and hanging plating integral plating, partial plating nickel plating, copper, gold, tin, etc., to meet various process requirements
1.Basic Info.
| Type | Reflective Panels Type Photoelectric Sensor |
| Model | To46 8pin |
| Pin Type | Kovar |
| Materlal | Cpcc Glass |
| Pin Quantity | 2/3/4/5/8 Pin |
| Authentication | ISO,RoHS |
| Customize or Not | Customized |
| Application | Alarm System,Sensor System |
| Gold Thinckness Test | Customer Requirements for Production |
| Standard Export Packing | Standard Ecport Packing |
| Source | China |
| Brand | XR |
| HS Code | 3711930783 |
2.Product Description
| NO. | Item | Condition | Standard |
| 1 | Insulation capability | Relative humidity less than 50%,and the temperature at 25±5ºC | More than 1×109Ω at DC500V and More than 1×1010Ω at DC50V |
| 2 | Leak test | Test with a helium mass spectrometer. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 3 | Lead loose | 3×180°bending after bent lead 90°and apply a force of 3N. | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 4 | Lead tension | 25N tension 5-10sec | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 5 | Lead bending | 3×(±90°)with a weight of 2.25N | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 6 | High temperature impact | 300ºC 10min. natural cooling | No leakage more than |
| 1×10-9Pa•m3/sec. | |||
| 7 | Bake test | 320ºC 5min | Not changing the color |
| 8 | Plating adherence | 2-6coiled at a Φ1mm mandrel | Nickel plating must be adherent,no peeling and no blistering. |
| 9 | Solderrability of leads | 160ºC 90min,flux 5-10s ,tinbath at 255±5ºC,5±0.5 seconds. | Leads shall be covered with solder up to 95%. |
Company Information&Services:
A.Every customer's admiration is our goal and future willing, we are concentrated in doing the best quality products, supplying the best goods and service.We striving to become a world-class service provider in the field of electronic hermetic packaging.
B.Main products: TO series headers and caps, butterfly packaging, cavity packaging, photoelectric metal shell, devices, hybrid integrated circuit, high power laser shell, microwave, RF terminal, flow terminal, OCXO housing, crystal resonator base, crystal oscillator base, UM base, ceramic LED bracket, SMD series base , and its products cover 13 series more than 500 specifications. Widely used in optical communication, sensing, Internet of things, microelectronics, medical defense,automotive, national defense, aerospace and other fields.
Sintering and surface treatment ability:
With sintering furnace, oxidation furnace, brazing furnace, brazing furnace, vacuum furnace, sintering furnace, meet different process design requirements, products involving alloy, iron-nickel alloy, stainless steel, low steel, tungsten, aluminum alloy and other metal materials of glass / ceramic packaging and metal brazing.
Self-built electrochemical plating production line, approved by the environmental protection bureau for pollutant discharge qualification. Independent grasp of surface treatment technology, can comprehensively control the surface treatment process, and can quickly and flexibly respond to the different coating thickness requirements of the client. Electroplating and chemical plating rolling plating and hanging plating integral plating, partial plating nickel plating, copper, gold, tin, etc., to meet various process requirements
