What are the types and processes of metal packaging?

Due to the advantages of good mechanical strength, good thermal conductivity, electromagnetic shielding function and easy machining, metal packaging has outstanding reliability under the harshest conditions of use, and is widely used in military and civilian fields. Generally, according to the division of packaging materials, metal packaging is divided into pure copper, alloy, cermet integrated packaging; According TO the different components of the package, the metal package includes at least TO package, BOX package, butterfly package, SMD package, large module metal package, passive crystal oscillator package, etc., which are common component packages.Our company's products mainly introduce the first four categories

1 .TO packages

The TO package is a typical metal package. The  TO package has the excellent performance of high-speed and high thermal conductivity. For high-speed devices in optical communication, the transmission rate above 25 Gbit / s; for electronic devices or modules requiring high heat dissipation efficiency, the use of high thermal conductivity TO shell packaging can achieve better heat dissipation effect. This kind of shell can replace the traditional loable alloy with anaerobic copper, and the thermal conductivity rate is more than 10 times that of the traditional shell.

At present, TO series specifications of our company include TO-18, TO-39, TO-46, TO-56, TO-5, TO-8, TO-9, TO60 TO33, etc. As shown in Figure 1, TO components of various specifications and models. Widely used in optical communication, sensors, detectors, attenuator and other fields. Figure 2 shows the matching pipe cap

The material used for TO casing is mainly stainless steel or kovar alloy. The entire structure consists of a base, lenses, external heat dissipation blocks, and other parts, with the structure coaxial above and below. Usually, the internal components of TO packaged lasers include laser chips (LD), backlight detector chips (PD), L-shaped brackets, etc. If equipped with an internal temperature control system such as TEC, internal components such as thermistors and control chips are also required. The following diagram is a schematic diagram of a TO laser with a lens

2．BOX packages

BOX package is a form of high-power semiconductor device, usually composed of multiple straight-in devices on a silicon substrate and fixed to the thermal conduction medium by grand finale or patch. The large-size BOX package example as shown in Figure 3 is widely used in the fields of hybrid integrated circuits, semiconductor integrated circuits, optoelectronic devices, microwave devices, sensors, and lasers

3．Butterfly packages

Butterfly package in the appearance of the shell is usually cuboid, which contains two lines of in-line pins, the structure and function are usually more complex, can be built in refrigeration, heat sink, ceramic base block, chip, thermistor, backlight monitoring, and can support all the above parts of the bonding lead, the shell area is large, good heat dissipation, can be used for various rates and 80km long distance transmission. The company's products include 14-lead butterfly package, 14-pin DFB, 8-channel , 6-PIN side window, etc.

4 SMD Package（HTCC）

SMD packaging is the most commonly used form of packaging in surface mount technology (SMT), which is to paste components directly onto the surface of the printed circuit board. SMD package size is small, light weight, excellent performance, automatic production and other characteristics, suitable for communication, computer, automotive electronics and other high density integrated circuits. Figure 4 shows an example of our SMD encapsulation.

We can provide customized products according to customer needs